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Industrial Equipment
Laser cutting machine marking
HUANIC low power semiconductor laser mainly provides marking indication for laser cutting machine, and feeds back the specific position of cutting slot through laser beam irradiation before cutting, which provides extremely accurate auxiliary indication for laser cutting machine.

 
A laser cutting machine focuses a laser beam emitted from a laser into a high power density laser beam through an optical path system. The laser beam irradiates the surface of the workpiece, so that the workpiece reaches the melting point or boiling point,while the high-pressure gas coaxial with the beam blows away the molten or vaporized metal. 
With the relative position of the beam and the workpiece moving, the material will eventually form a cutting slit to achieve the purpose of cutting.
Laser cutting processing replaces traditional mechanical knives with invisible beams. It has the features of high precision, fast cutting, is not limited to cutting pattern limitation, saves materials by automatic typesetting, smooth cuts, low processing cost, etc., and will gradually improve or replace traditional metal cutting process equipment. The mechanical part of the laser cutter head has no contact with the workpiece, and it will not scratch the surface of the workpiece during operation; the laser cutting speed is fast, the incision is smooth and flat, and generally no subsequent processing is required; the cutting heat affected zone is small, the sheet deformation is small, and the slit is narrow ( 0.1mm~0.3mm); no mechanical stress in the incision, no shear burr; high processing precision, good repeatability, no damage to the surface of the material; NC programming, machinable arbitrary plane graph , can cut the whole board with large format, no need Open the mold, saving time and economy.

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